NEPCON OsakaTranslation site

NEPCON Osaka is one stop in the annual NEPCON JAPAN series, which also includes editions in Tokyo and Nagoya. This series collectively forms the largest electronic R&D and manufacturing exhibition network in Asia, attracting thousands of exhibitors and tens of thousands of visitors from around the world.

Event Snapshot (2026)

• Dates: May 13 (Wed) – 15 (Fri), 2026
• Venue: INTEX Osaka, Japan
• Opening Hours: 10:00 – 17:00 (JST)
• Expected Scale: Exhibitors Approx. 700 ;Visitors  Approx. 42,000 (including concurrent shows)

Purpose & Significance

NEPCON Osaka is designed to serve the local and regional electronics industry by providing a platform to:

• Showcase the latest technologies and equipment in electronic design, R&D, and manufacturing.
• Facilitate business matching between suppliers and manufacturers in Western Japan.
• Connect industry professionals from automotive, electronics, and semiconductor companies.

As a regional edition of the larger NEPCON JAPAN brand, it offers a more focused opportunity to engage with the Kansai manufacturing base.

Venue: INTEX Osaka

• Location: Conveniently located in the center of Osaka, a major hub for Japan’s electronics and manufacturing industries.
• Accessibility: Easily accessible by public transportation, providing a strategic advantage for business visitors from across the Kansai region.

Key Exhibition Areas

NEPCON Osaka features a comprehensive range of exhibits, typically including the following technology zones:

• SMT / Electronics Manufacturing: Surface-mount technology (SMT) equipment, soldering systems, automation lines, and EMS/contract manufacturers.
• Testing & Measurement: AOI/AXI systems, functional testing, reliability testing, and EMC testing tools.
• IC & Sensor Packaging: Packaging equipment, advanced IC packaging technologies (e.g., FOWLP, CSP), and sensor packaging solutions.
• PCB / PWB: PCBs, PCBA, flexible circuits, and related manufacturing equipment and materials.
• Electronic Components & Materials: Connectors, resistors, sensors, power devices, conductive adhesives, and thermal management materials.
• Power Devices & Modules: Power semiconductors (SiC/GaN), power modules, inverters, and thermal solutions.
• Fine Process Technology: Micro-machining, laser processing, precision molds, and other advanced manufacturing technologies.

Event Highlights

• Business-Focused: Emphasizes B2B matchmaking and procurement, attracting engineers and managers from leading companies.
• Concurrent Shows: Co-locates with other specialized exhibitions, creating a comprehensive industry cluster and drawing a larger, more diverse audience.
• Technology Seminars: Hosts technical presentations and panel discussions on topics like smart manufacturing, automotive electronics, and advanced packaging.